| VisEdge CV300-R |
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Wafer Edge Inspection System for Increased Yield
Product Description The VisEdge CV300 edge inspection system is the first solution capable of meeting the full range of wafer edge inspection requirements in a production environment. The tool's unique optical design and advanced defect classification capabilities allow IC manufacturers to utilize complete wafer edge scanning and capture of both macro-and micro-based defects with high sensitivity, for broader defect capability and better distinction of edge defectivity to increase yield.VisEdge CV300-R The new VisEdge CV300R incorporates a high resolution, megapixel digital microscope to review individual edge defects found by the system. Operating directly on the system's inspection stage, the review microscope can rapidly photograph any potential defect found during inspection with 2-micron resolution that can capture the great majority of edge defects. The unique capability to inspect and then review individual edge defects, with micron level resolution and color imaging, enables closed-loop defect control methodology used by the fab to be migrated to the wafer edge. Application Wafer Manufacturing: Manufacturing process monitoring to provide classified/actionable defect data. IC Product Wafer Inspection Lithography and etch processes: Resist and etch residues can induce backside particulate problems leading to hotspots, or generate particles that can migrate onto the patterned area. Immersion Lithography: Mechanical coupling of the scanner head to the wafer surface through the immersion fluid drives new, critical performance requirements for the edges of the lithography film stack. Particle generation and transfer to the patterned area or the wafer stage are serious consequences from poor film edge control. Related Information
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