Defect Inspection

Patterned Wafer

VisEdge CV300-R
Wafer Edge Inspection System

Product Description

The VisEdge CV300-R wafer edge inspection system utilizes innovative technology to meet edge-defect inspection and edge-bead removal (EBR) metrology requirements for development and volume production of wafers and ICs.


  • Unique, multi-channel optical design leverages simultaneous brightfield, darkfield, phase-contrast and topography modes to capture a broad range of macro and micro edge defect types with industry-leading sensitivity
  • Rules-based defect classification algorithms operate on multi-channel data to minimize edge background noise and achieve high classification accuracy and purity
  • Unique phase channel and continuous-scan design enable one-pass measurement of the complete EBR film stack, allowing accurate characterization of coverage, concentricity and uniformity of the edges of the stack, on either the front edge or the side bevel
  • On-board, high resolution microscope enables review of individual edge defects for quick disposition
  • Stand-alone design, dedicated to wafer edge inspection, enables highest-resolution data collection from all zones comprising the wafer’s edge: top and bottom near-edge; top and bottom bevel; and apex

Application

IC Manufacturing:

Immersion Lithography: Mechanical coupling of the scanner head to the wafer surface through the immersion fluid drives new, stringent specifications for the edges of the lithography film stack. VisEdge defect data helps engineers ramp immersion processes and monitor costly cross-contamination issues in production.

Edge Bead Removal: VisEdge’s EBR metrology application characterizes nonuniform edges and identifies overlapping films—key measurements as die real estate concerns shrink the total width of the boundary of the film stack and push it into the side bevel. Improved edge uniformity correlates with lower defect counts generated during immersion lithography.

Deposition, Etch and CMP: VisEdge wafer defect inspection system detects film delamination and flaking created by deposition over residues. These defects generate particles that can migrate to the patterned area of the wafer and affect yield.

Bevel Etch and Clean: Engineers can use VisEdge to optimize and monitor the effectiveness of the bevel removal process in both development and production by monitoring defectivity pre-and post-processing.

Wafer Manufacturing:

During wafer production VisEdge monitors for defects such as particles, scratches, mechanical damage, chipping and cracking.

 

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